Can you make something like this? Can you do something like that?
We bring such wishes to life.

At Kyosei, our +ONE solution combines precision processing using photo etching technology with a diverse range of other processes to realize unprecedented and innovative shapes and functions.

Technical details

Precision processing

Processed cross section
Processing limits(1)
Processing limits(2)
Thickness (T)Minimum dimension of DPractical minimum dimension of DPractical minimum dimension of WPrecision of DW
5〜12.5 ㎛ Determined by prototyping Determined by prototyping Determined by prototyping Determined by prototyping
25 ㎛
50 ㎛ ≒ 1.6T 100 ㎛ ≒ 0.7T ± 15㎛
100 ㎛ ≒ T 150㎛ ≒ 0.5T ± 15㎛
150 ㎛ 200 ㎛ ± 25㎛
250 ㎛ 250 ㎛ ± 40㎛
500 ㎛ 500 ㎛ ± 75㎛

If you require a higher level of precision than listed above, please feel free to consult with us.

Bridge shapes

Bridge shapes

In the etching process, a bridge is required to connect the product with the frame. Here we present Kyosei’s standard bridge. Our more customized bridges are not posted here due to intellectual property concerns.

Supported materials

Gold, silver, palladium, pure copper, brass, phosphor bronze, BeCu, nickel silver, copper-titanium alloys, SUS, Hastelloy, Inconel, permalloy, Kovar, tungsten, molybdenum, amorphous metals, aluminum, titanium, magnesium, Alloy 42, iron, nickel, and more.

Major fields of application